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Plate Holes


"I have a problem with my cell. When the Cell is powered Off, the water completely fills the cell. When the Cell is powered ON, 1/4 of the water is going back into the Reservoir. The Cell operates with only 3/4 of the portion of water. Is there a remedy for this?. Will a hole in the middle of the plate solve the problem?"

How would or could "a hole in the middle" have an effect on the Active surface area of the cell?
You have a hole near the bottom of the cell. What does it do? It allows water from the Bubbler/Reservoir to fill each water compartment. It does so because the Bubbler is higher than the cell; vacuum, gravity, and the weight of the water maintains the water level. If that were the only hole in the plate, what would happen? Think about that! You turn the cell ON. It starts producing HHO gas. Where does the gas go? Well it goes UP. It is lighter than water so it rises; as long as gravity allows it. So if it rises, it will do so until it reaches the TOP of the water level. How is it going to get out of the water compartment? I am asking you to think. While you are thinking, the HHO gas is collecting at the TOP. While it is collecting, it is displacing the water; pushing down on the water. There is only one way out ------ and that is through the same hole that lets water in. So where does the water go? It goes back to where it came from ---- the Bubbler. When can the HHO gas get out of the water compartment? It has to displace the water until the water level reaches the top of the Hole. Then, and only then, can the HHO gas escape. Think about that.
While all of that is happening, what effect does it have on HHO production?
Well, the gas is manufactured on the plate surfaces ---- the parts the water touches. So as the water level goes down, what happens to gas production? Does it increase? Does it decrease? Neither, it stays the same? For the most part, It stays the same because the same amount of Amperage is passing across a smaller Active Surface Area. And because the active surface area is smaller, there will be more heat produced. As the heat builds up, it will decrease the electrical resistance of the water, and that will cause Amperage to increase, and as amperage increases, so will HHO gas production. Confusing?
So we need another hole; one to let the HHO gas out of the water compartments. I ask you,  "where should it be"? If you put it in the middle of the plate ------- it will let the gas out once it collects down to the middle. If you put it 3/4's of the way to the top, it will escape once it reaches that point. As long as there is water above the hole, gas is going to collect there until it pushes the water down to that hole. You can add as many holes as you want and you will not do anything but remove Active Surface Area. The HHO gas will escape out the top hole ---- where ever it may be.
Any Surface Area above the top hole will become Inactive as HHO gas collects there, It does so because the water level changes. And there is something else to think about. That area above the top hole becomes a storage area for the gas to collect in. The more gas you store, the more risk of an explosion. It is safer to keep that area at a minimum. You will also observe a pulsing of the gas. The pulsing happens as the gases collect and exit, collect and exit, collect and exit.
To solve this problem, on your cell, just drill another hole, above the hole you presently have at the top. Drill it closer to the TOP. How close?  You don't want the top hole so close to the gasket that the gasket can slip into it, but you do want the hole close.

Look at the image below.

I would move the top hole to where I have the red circle.

I would also do away with the center hole.

For a little better water circulation, I would move the bottom hole closer to the gasket; preferably, I would do it exactly like the top hole.

As for the gasket, there is nothing wrong with where it is. But, look how much surface area it is wasting.

If you are concerned with Current Leakage via the holes, there are a few things you can do. You can use Sikaflex 291 to cover the exposed edges of the holes. But a better method is to just round off the sharp edges, on both sides of the plates. Electron Flow is going to take the Least path of resistance as it travels from negative towards positive. The surface of the plate is a lot less Resistant, electrically, than that of the electrolyte water. The problem is, electrons have a hard time making sharp 90 degree turns. Round off those sharp edges and you will reduce the problem. It also works on the plate edges. Wet Cells are a lot more efficient if you round off the edges.

    Copyright 2003   All rights reserved.   Revised: 04/03/22.                                             Web Author, David Biggs
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